Forbes Column

May 19, 2021
Qualcomm Extends 5G Efforts With New Modems

By Bob O'Donnell

One of the things that people often forget about 5G is that it is an evolving standard. Not only are the technical specifications behind the communications protocol continuing to improve via things like the 3GPP’s current Release 16 and forthcoming Release 17 documents, so too are the means by which 5G is being deployed (see “The Evolution of 5G” for more). In a related manner, we’re also starting to see some of the first real-world implementations of 5G beyond smartphones.

In clear recognition of all these developments, Qualcomm made several announcements at their virtual 5G Summit event highlighting how the company is working to continue their own efforts at making 5G devices more capable and more widely available. Not surprisingly, much of the news is focused on new modems and RF technologies.

The x65 Modem-RF system, which was initially released along with the lower-cost x62 in February (see “Latest Modems From Qualcomm And MediaTek Highlight 5G Progress”), is receiving several new capabilities thanks to its software upgradable architecture. Qualcomm calls the x65 a fourth-generation 5G modem to antenna solution and a true Release 16-compatible device. The new features include improved power efficiency for extended battery life as well as extended support for mmWave-based 5G networks. Most of these frequencies are expected to be used in new mmWave rollouts that are starting to happen in China and Japan.

On the performance front, the x65 also adds support for 200 MHz of bandwidth in the mmWave spectrum and supports carrier aggregation of up to 1 GHz of mmWave and 300 MHz of sub-6 frequencies in both FDD and TDD bands. The real-world result is the potential for a wired Ethernet-like 10 Gb/s maximum throughput—though real-world numbers are always a fair bit lower than the theoretical limits. Still, it’s an important milestone for 5G modems and illustrates how the technology behind them continues to improve. Also, while the details of the various types of carrier aggregation can get complicated quickly, the key takeaway is the latest generation modems continue to offer more flexibility in terms of what types of 5G networks they connect to as well as maximizing the potential throughput on various network types.

While initial 5G modems represented exciting technical breakthroughs, the truth is, they faced a number of limitations that weren’t widely understood. With developments like the x65, we’ve clearly moved into an era where those limitations have been completely removed and the additional features and capabilities promised for 5G can start to be realized.

In that light, another x65-related announcement Qualcomm made at the 5G Summit could end up having even more real-world impact. Specifically, Qualcomm unveiled a set of module reference designs—one for the x65 and another for the x62—that should make the process of integrating 5G into multiple other devices much simpler. The module designs are based on the M.2 format, which is commonly used in laptop PCs for adding SSD drives (and other modems) and can be easily integrated into other devices. The beauty of this module approach is that companies who want to incorporate 5G connectivity in their devices but don’t have 5G design expertise in-house can leverage the certification work and other engineering effort that Qualcomm and its module partners (companies like Sierra Wireless, etc.) have already done.

The end result is that we should soon start to see 5G being built into more devices such as XR headsets, cable and telco home routers (sometimes called CPE or customer premise equipment), IoT devices, PCs and more. In the case of PCs, the Qualcomm module provides a clear alternative to the MediaTek module that was built in conjunction with Intel (see “Intel Makes Surprise Pick for 5G PC Modem Partner”) and is just starting to appear in new laptops from major vendors. As with most all Qualcomm modems, the x65 and x62 modules all support mmWave as well as sub-6 frequencies (including forthcoming C-Band frequencies here in the US), whereas the MediaTek T700 module only supports sub-6.

The final bit of news from the 5G Summit reflects the real-world impact of the ongoing worldwide chip shortage. Qualcomm unveiled the new Snapdragon 778G SOC, which is very similar in design to the recently released Snapdragon 780G. As the product numbers suggest, the 778 is slightly less full-featured than the 780, but practically speaking, it offers nearly identical capabilities. The 778G has the triple ISP architecture for enabling simultaneous use of up to three cameras, enhanced graphics support for mobile gaming, an X53 5G modem, and Qualcomm’s sixth generation AI engine. The biggest difference is that Qualcomm is having this chip produced on Samsung’s 6 nm process instead of the 5 nm TSMC process that the company is using for the 780. Realistically, this is Qualcomm’s effort to spread their manufacturing base to a broader range of partners to help ensure availability of its 5G-equipped SOCs—a practical necessity in today’s environment.

Ultimately, the story from the 5G Summit is one of continued evolution for 5G components as well as the range of devices that we can expect to find them in. It’s also likely a good example of the type of 5G-related component news we can expect moving forward—not terribly dramatic, but useful and practical nonetheless.

Disclosure: TECHnalysis Research is a tech industry market research and consulting firm and, like all companies in that field, works with many technology vendors as clients, some of whom may be listed in this article.

Here’s a link to the original column: https://www.forbes.com/sites/bobodonnell/2021/05/19/qualcomm-extends-5g-efforts-with-new-modems/

Forbes columnist Bob O'Donnell is the president and chief analyst of TECHnalysis Research, a market research and consulting firm that provides strategic consulting and market research services to the technology industry and professional financial community.